To provide a method for properly performing by laser welding, electric connection between an IC module and an antenna pattern, which constitute an inlet included in a non-contact type communication medium.

A method for manufacturing a non-contact type communication medium including an inlet where an IC module is connected to an antenna pattern is performed as follows. When the inlet 2 is formed, where the IC module 6 including a connection terminal 91 wired to an IC chip 8 and exposed and the IC chip is connected to the antenna pattern 4 on a thermoplastic insulation substrate 3, a prescribed surface of the antenna pattern is positioned by contact at a corresponding position of the exposed connection terminal, and then, welded by laser irradiation at a plurality of points by each corresponding set in the connection terminal and the antenna pattern from the side of the thermoplastic insulation substrate.