Title:
非共晶はんだ組成物
Document Type and Number:
Japanese Patent JP4938980
Kind Code:
B2
Abstract:
A lead free solder hierarchy for use in the second level solder connection of electronic components such as joining an electronic module to a circuit board. An off-eutectic solder concentration of SnCu or SnAg is used for the module side connection. This off-eutectic solder contains sufficient intermetallics to provide the module side connection with a robust second level assembly and rework process. The off-eutectic composition provides an inter-metallic phase structure in the module side fillet during assembly. The inter-metallic phase structure eliminates problems of tilt and collapse during second level assembly and aids in rework by providing a more cohesive joint allowing removal of the columns from the board without simultaneous removal from the module.
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Inventors:
Interante, Mario
Furcock, Mukta, Gee
Sabrinski, William, Edward
Furcock, Mukta, Gee
Sabrinski, William, Edward
Application Number:
JP2004537867A
Publication Date:
May 23, 2012
Filing Date:
September 12, 2003
Export Citation:
Assignee:
INTERNATIONAL BUSINESS MASCHINES CORPORATION
International Classes:
B23K1/00; B23K35/26; B23K35/14; C22C13/00; H05K3/34; B23K101/40; B23K101/42
Domestic Patent References:
| JP2002124533A | ||||
| JP200257177A |
Foreign References:
| WO2002068146A1 |
Attorney, Agent or Firm:
Takeshi Ueno
Tasaichi Tanae
Yoshihiro City
Tasaichi Tanae
Yoshihiro City