NON-HALOGEN FLAME-RETARDANT ADHESIVE COMPOSITION

Japanese Patent JP2005068315

A

To provide a non-halogen flame-retardant adhesive composition excellent in adhesiveness and flame retardance without generating harmful gas during combustion and to provide a flexible printed circuit board using the non-halogen flame-retardant adhesive composition.

The non-halogen flame-retardant adhesive composition is constituted of a structure 20 composed of a first layer 12 composed of magnesium hydroxide 11 and stearic acid for covering magnesium hydroxide 11 in turn and a second layer 13 composed of an organic silane coupling agent, a base resin 10 containing at least an epoxy resin in which the structure 20 is mixed, a curing agent and a carboxy group-containing rubber. In the adhesive composition, the ratio of the structure 20 occupied in the non-halogen flame-retardant adhesive composition is kept to 10-50 vol.% and the particle diameter of magnesium hydroxide is kept to ≤1 μm.

SUGIYAMA SHUICHI
SENSO TOMOMITSU
MORIYA HIDENORI
ICHIKAWA MASATERU
SHINODA TATSUNORI

JP2003301387A

March 17, 2005

August 26, 2003

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FUJIKURA LTD

C09J163/00; C09J11/04; C09J113/00; H01L21/60; H05K3/28; H05K3/38; (IPC1-7): C09J163/00; C09J11/04; C09J113/00; H01L21/60; H05K3/28; H05K3/38

Masatake Shiga
Tadashi Takahashi
Takashi Watanabe
Masakazu Aoyama

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