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Title:
NON-PERIPHERAL PROCESSING CONTROL MODULE HAVING IMPROVED HEAT DISSIPATING CHARACTERISTICS
Document Type and Number:
Japanese Patent JP2013054753
Kind Code:
A
Abstract:

To improve heat dissipating characteristics of a processing control unit.

A housing body for a computer processing control unit comprises: a main support chassis having a plurality of wall supports and a plurality of junction centers containing means for supporting a computer component within the housing body; a back surface that provides support for connecting a peripheral device and other computing components; and means for cooling the housing body.


Inventors:
SULLIVAN JASON
Application Number:
JP2012233843A
Publication Date:
March 21, 2013
Filing Date:
October 23, 2012
Export Citation:
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Assignee:
SULLIVAN JASON
International Classes:
G06F1/20; G06F1/16; H05K7/00; H05K7/18; H05K7/20; G06C
Domestic Patent References:
JPH05145208A1993-06-11
JP2000305652A2000-11-02
JPH1165708A1999-03-09
JP2002258985A2002-09-13
Attorney, Agent or Firm:
Sadao Kumakura
Fumiaki Otsuka
Disciple Maru Ken
Ino Sato