Title:
NONAQUEOUS RESIN DISPERSION
Document Type and Number:
Japanese Patent JP3390284
Kind Code:
B2
Abstract:
PURPOSE: To obtain a nonaq. resin dispersion which can form a coating film excellent in adhesive properties, resistances to water, alkalis, and solvents, etc., by compounding a specific org. solvent, an acrylic polymer sol. in the solvent, polymer particles insol. in the solvent, and if necessary a cross-linker.
CONSTITUTION: This nonaq. resin dispersion comprises an org. solvent mainly comprising an aliph. hydrocarbon solvent, an acrylic polymer sol. in the solvent and contg. 0.2-30wt.% repeating units represented by formula I (wherein R1 and R2 are each H or CH3; Y is a single bond,-CH2-, a group of formula II, or -CONH-R4-; R3 and R4 are each 1-6C alkylene; m is 3-11; and n is 0-10), polymer particles substantially insol. in the solvent, and if necessary a cross- linker. The dispersion is excellent in pigment dispersion, storage stability, pot life, and adhesion to the surface of a metal substrate, etc., and can form a cold-curing coating film excellent in adhesive properties, resistances to water, alkalis, solvents, and weathering, etc.
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Inventors:
Takao Fujii
Hiroaki Obata
Hiroshi Serizawa
Hiroaki Obata
Hiroshi Serizawa
Application Number:
JP5821095A
Publication Date:
March 24, 2003
Filing Date:
February 23, 1995
Export Citation:
Assignee:
Nippon Carbide Industry Co., Ltd.
International Classes:
C08L33/14; C08L25/08; C08L33/04; C08L33/06; C08L35/02; (IPC1-7): C08L33/06; C08L25/08
Domestic Patent References:
| JP5540711A |
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