To provide a noncontact data carrier device, having antenna coils composed of a laminated structure of three or more layers, and having high communication efficiency, and to provide a manufacturing method therefor.
In this noncontact data carrier device composed of the antenna coils, capacity patterns, and IC chips connected to the capacity patterns, the noncontact data carrier device is characterized by being composed of the laminated structure of three or more layers by folding up an antenna sheet 1 formed by polyhedrally attaching a pattern having the almost same shape in the antenna coils 11 to 61 and the capacity patterns 18 to 68 to a base material 10, and composed of the capacity patterns and the antenna coils so as to respectively overlap in a shape of the antenna coils and the capacity patterns. Such constitution can be formed into a shape of omitting the capacity patterns. This manufacturing method of a noncontact data carrier is composed of a process of manufacturing a polyhedrally attaching sheet of the antenna coils, a process of installing the IC chips, a process of folding up and laminating the antenna sheet, etc.
IKEUCHI TATSUYA
HIGUCHI TAKUYA
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