Title:
NONCONTACT TEMPERATURE SENSOR
Document Type and Number:
Japanese Patent JP2014126441
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a noncontact temperature sensor that is configured such that a compensating heat-sensitive element and a detecting heat-sensitive element are close to each other in the thermal condition, variation in output sensitivity is made smaller, output response is ensured, and that can be formed at a low cost.SOLUTION: A detecting heat-sensitive element 10 and a compensating heat-sensitive element 11 are provided on the surface of a rigid substrate 9. An infrared absorption layer, a heat conductive layer, and a main conductive layer are provided in an area where the detecting heat-sensitive layer is arranged. The heat conductive layer and the main conductive layer are electrically connected via a through-hole extending through the substrate. Additionally, the sub-conductive layer is formed so as to extend in four directions from the main conductive layer, and through-holes are formed in the leading end thereof, the through-holes being also connected to the heat conductive layer.
Inventors:
USHIODA KENTARO
KOBAYASHI HIROSHI
ZAIMA SEIGO
KOBAYASHI HIROSHI
ZAIMA SEIGO
Application Number:
JP2012282967A
Publication Date:
July 07, 2014
Filing Date:
December 26, 2012
Export Citation:
Assignee:
TDK CORP
International Classes:
G01J5/10; G01J1/02; G01J5/20
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