Title:
NONDESTRUCTIVE FILM THICKNESS MEASURING METHOD USING ELECTRON BEAM IRRADIATION
Document Type and Number:
Japanese Patent JP2023074503
Kind Code:
A
Abstract:
To provide a non-destructive method for measuring film thickness of an object exceeding 1 μm in thickness, even in a complex shape or a micro area.SOLUTION: The intensity of characteristic X-rays (Kα rays) generated from an element in a base material by electron beam irradiation correlates with thickness of a thin film on a surface of the base material in a specific thickness range, thereby it is found that a method using an electron beam can measure thickness of an object with a film thickness exceeding 1 μm.SELECTED DRAWING: Figure 1
Inventors:
NIKU NORINAGA
MARUOKA TOMOKI
MARUOKA TOMOKI
Application Number:
JP2022183564A
Publication Date:
May 29, 2023
Filing Date:
November 16, 2022
Export Citation:
Assignee:
TNJ HOLDINGS CO LTD
KYOTO MUNICIPAL INSTITUTE OF INDUSTRIAL TECH & CULTURE
KYOTO MUNICIPAL INSTITUTE OF INDUSTRIAL TECH & CULTURE
International Classes:
G01B15/02
Attorney, Agent or Firm:
Masayuki Nakagawa
Previous Patent: Member joining structure and unit
Next Patent: Tableting punch and die maintenance management system
Next Patent: Tableting punch and die maintenance management system