To provide a nonradioactive dielectric line of lower loss wherein adhesion between a conductor plate and a dielectric line is made superior without needing post processing.
The dielectric line 4 is arranged between conductor plates 1, 2 of a parallel plate shape which are arranged up and down, and the upper and the lower conductor plates 1, 2 are held through a spacer 3 at predetermined interval. The dielectric line 4 is the nonradioactive dielectric line whose height is smaller than the predetermined interval and which is bonded to the lower conductor plate 1 by filling the interval with adhesive 5. Since structure is installed wherein the dielectric line 4 is bonded to the lower conductor plate 1 by filling the interval with the adhesive 5, adhesiveness between the dielectric line 4 and the lower and the upper conductor plates 1, 2 can be made good by matching the sum total height of the dielectric line 4 and the adhesive 5 with the predetermined interval.
KISHIDA YUJI
HIRAMATSU NOBUKI
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