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Patent Searching and Data


Title:
NORMAL TEMPERATURE-TACKY AND THERMOSETTING EPOXY-BASED ADHESIVE COMPOSITION, TACKY FILM AND METHOD FOR BONDING
Document Type and Number:
Japanese Patent JPH06107907
Kind Code:
A
Abstract:

PURPOSE: To provide an epoxy-based adhesive composition giving excellent tackiness at normal temperatures, and also giving tough adhesiveness on curing by heating.

CONSTITUTION: The objective composition can be obtained by incorporating (A) 100 pts.wt. of a liquid epoxy resin (Epikote 828) with (B) 25 pts.wt. of a carboxyl group-contg. vinyl chloride-based polymer prepared by copolymerization between 100 pts.wt. of vinyl chloride and 6 pts.wt. of monobutyl maleate and (C) 10 pts.wt. of dicyandiamide. A polyester film 25μm thick is coated with this composition at a thickness of 50μm followed by heating at 120°C for 15min to obtain the second objective tacky film. The third objective usage of this composition is such that the surface of a base is coated with this composition followed by heating at 120°C for 15min to form a tacky film which is then laminated with another base followed by heating at 180°C for 60min to effect curing.


Inventors:
Ishiguro, Minoru
Application Number:
JP1992000285067
Publication Date:
April 19, 1994
Filing Date:
September 30, 1992
Export Citation:
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Assignee:
NIPPON ZEON CO LTD
International Classes:
C08G59/18; C08L63/00; C09J7/00; C09J163/00; (IPC1-7): C08L63/00; C08G59/18; C09J7/00; C09J163/00