NOTCH POLISHING APPARATUS, BEVEL POLISHING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Title:

NOTCH POLISHING APPARATUS, BEVEL POLISHING APPARATUS, AND METHOD OF MANUFACTURING SEMICONDUCTOR DEVICE

Document Type and Number:

Japanese Patent JP2011086732

Kind Code:

A

Abstract:

To sufficiently remove burrs (whiskers) caused in a notch polishing pad.

The notch polishing apparatus includes the notch polishing pad 2 having a polishing portion 2a configured to polish a notch 6 of a semiconductor wafer 5, and a deburring mechanism 1 configured to remove a burr (whisker 11) formed at a periphery of the polishing portion 2a of the notch polishing pad 2. The deburring mechanism 1 includes a deburring member (for example, deburring wire 3) comprising a body portion 3a made of a material capable of deforming in conformity with the notch polishing pad 2, and abrasive grains 3b sticking on a surface of the body portion 3a. In a state wherein the deburring member (deburring wire 3) is brought into contact along the notch polishing pad 2, the notch polishing pad 2 and deburring member (deburring wire 3) are moved relatively to remove the burr (whisker 11).

Inventors:

WATANABE KAORI

Application Number:

JP2009237673A

Publication Date:

April 28, 2011

Filing Date:

October 14, 2009

Export Citation:

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Assignee:

RENESAS ELECTRONICS CORP

International Classes:

H01L21/304; B24B9/00; B24B37/00; B24B37/20; B24B53/00; B24B53/017; B24B53/12

Attorney, Agent or Firm:

Shinji Hayami
Kana Nomoto
Satoshi Amagi

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