Title:
NOVEL COMPOUND AND HEAT-RESISTANT FILLER HAVING ORGANIC CLAY COMPOSITE COMPRISING THE SAME
Document Type and Number:
Japanese Patent JP2009173496
Kind Code:
A
Abstract:
To provide a heat-resistant filler comprising an organic clay composite excellent in heat resistance and dispersibility.
It has been found that a heat-resistant filler comprising an organic clay composite exhibits no discoloration upon being heated, and little reduction in the deterioration of dispersibility, by preparing interlaminar inorganic cations of a swellable layered silicate by using an alkyltris(4-phenoxyphenyl)phosphonium salt being a novel compound. And, the alkyl group of the alkyltris(4-phenoxyphenyl)phosphonium salt is selected from among 4-22C ones, and particularly when it is a 18C alkyl group, the best result can be attained.
Inventors:
SAITO KEIJI
OHASHI KENJI
ONIGATA MASANOBU
MINASE SHIN
OYA MITSURU
OHASHI KENJI
ONIGATA MASANOBU
MINASE SHIN
OYA MITSURU
Application Number:
JP2008015184A
Publication Date:
August 06, 2009
Filing Date:
January 25, 2008
Export Citation:
Assignee:
HOKKO CHEM IND CO
HOJUN KK
HOJUN KK
International Classes:
C01B33/44; C08K9/04; C08L101/00
Attorney, Agent or Firm:
Tetsuo Yamaguchi
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