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Patent Searching and Data


Title:
NOVEL MOLDING COMPOUND
Document Type and Number:
Japanese Patent JPS5661401
Kind Code:
A
Abstract:

PURPOSE: A molding compound with excellent strength, useful as an encapsulating material, a dialysis material, an ion-exchange material, etc., which is obtained by the acylation or acid treatment of part of a crosslinked chitin derivative.

CONSTITUTION: One or a mixture of at least two, of ionic crosslinked chitin derivatives of formula IV or V, having a main structure of formula I or II [wherein R1 is H, CnH2n+1, (CH2)nOH or CO(CH2)n-1CH3; R2 is H, CnH2n+1, (CH2)nOH, formu la III, (CH2)n or COOM, m is 1W20; M is H or an alkali (or alkaline earth) mettal], in which the 3 and 6' positions, or the 3, N and 6' positions are crosslinked to a degree of crosslinking of 0.01W0.3, is acylated by reaction with an organic acid (anhydride) such as acetic acid (anhydride) or propionic acid (anhydride) at 5W 80°C, to obtain a chitin molding compound.


Inventors:
KOSUGI JIYUNICHI
Application Number:
JP13733779A
Publication Date:
May 26, 1981
Filing Date:
October 24, 1979
Export Citation:
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Assignee:
KUREHA CHEMICAL IND CO LTD
International Classes:
A61K31/715; A61M1/36; B01D15/08; B01D71/08; B01J20/24; B01J39/16; B01J43/00; C08B37/08; C12N11/10; (IPC1-7): C08B37/08