PURPOSE: To provide a high adhesive property to a metallic substrate and to prevent excessive throwing during plating by using a nongaseous ethylenic unsatd. compound having at least two C-C double bonds and capable of forming a polymer in the presence of a photopolymn. initiator, the photopolymn. initiator which can be activated by active light, and a compound represented by a specified structural formula as constituent components.
CONSTITUTION: This photopolymerizable composition consists of a nongaseous ethylenic unsatd. compound having at least two C-C double bonds and capable of forming a polymer in the presence of a photopolymn. initiator, the photopolymn. initiator which can be activated by active light, and a compound represented by formula I. In the formula I, X is mercapto or -NHZ (Z is H or 1W8C alkyl), preferably mercapto, amino, methylamino or ethylamino, especially preferably mercapto, and Y is H, 1W20C alkyl, 6W20C aryl, arylalkyl or sulfoxymethyl, preferably H, methyl, ethyl, butyl, phenyl, benzyl or CH2SO3H, especially preferably methyl, ethyl or phenyl. Said ethylenic unsatd. compound has at least two terminal ethylene groups and forms a polymer in the presence of said photopolymn. initiator. It is nongaseous and has ≥100°C b.p. under atmospheric pressure.
IKEDA AKIHIKO
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