Title:
Novolac resin-containing resist underlayer film forming composition using bisphenol aldehyde
Document Type and Number:
Japanese Patent JP6332645
Kind Code:
B2
Abstract:
Ar1 and Ar2 each are C6-40 aryl group. The organic compound A including aromatic ring may be aromatic amine or phenolic hydroxy group-containing compound. The composition may contain further solvent, acid and/or acid generator, or crosslinking agent. Forming resist pattern used for semiconductor production, including forming resist underlayer film by applying the resist underlayer film-forming composition onto semiconductor substrate and baking it.
Inventors:
Takafumi Endo
Keisuke Hashimoto
Nishimaki Hirokazu
Rikimaru Sakamoto
Keisuke Hashimoto
Nishimaki Hirokazu
Rikimaru Sakamoto
Application Number:
JP2015517050A
Publication Date:
May 30, 2018
Filing Date:
May 08, 2014
Export Citation:
Assignee:
Nissan Chemical Industry Co., Ltd.
International Classes:
G03F7/11; C08G14/073; G03F7/26; H01L21/027
Domestic Patent References:
| JP2012145897A | ||||
| JP7268049A | ||||
| JP2012098431A | ||||
| JP5125149A |
Attorney, Agent or Firm:
Hanabusa Patent and Trademark Office