Title:
半導体用の鋸のためのノズル組立体
Document Type and Number:
Japanese Patent JP2007522949
Kind Code:
A
Abstract:
Improved systems and methods for singulating a substrate into a plurality of integrated circuit devices are disclosed. One aspect of the invention corresponds to a fixture that holds the substrate during the dicing process. Another aspect of the invention pertains to a nozzle assembly that provides better fluid flow over the cutting blades. Another aspect of the invention corresponds to a nozzle adjustment assembly that helps position the nozzles relative to the blades. Another aspect of the invention corresponds to spacers that reduce the problem of imbalance caused by fluid retained therein. Yet another aspect pertains to the composition of the fluid, which is distributed by the nozzle assembly to the blades.
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Inventors:
Intfeld, Frederik Har
Prajukkamol, Atapol
Safeneje, Johannes Har
Donkel, Marc Ev
Prajukkamol, Atapol
Safeneje, Johannes Har
Donkel, Marc Ev
Application Number:
JP2006553757A
Publication Date:
August 16, 2007
Filing Date:
February 23, 2005
Export Citation:
Assignee:
Koninklijke Philips Electronics N.V.
International Classes:
B24B55/02; B23D59/02; B24B27/06; B24B49/00; B27B5/34; B28D5/00; B28D5/02; B28D7/02
Attorney, Agent or Firm:
Kenji Sugimura
Kosaku Sugimura
Kiyoshi Kuruma
Shiro Fujitani
Tatsuya Sawada
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito
Hitoshi Nagasaka
Kosaku Sugimura
Kiyoshi Kuruma
Shiro Fujitani
Tatsuya Sawada
Tadahiko Ito
Shinsuke Onuki
Tadashige Ito
Hitoshi Nagasaka