Title:
NOZZLE DEVICE, AND SUBSTRATE GRINDING DEVICE USING
Document Type and Number:
Japanese Patent JP3792043
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a polishing device capable of efficiently flattening a substrate surface in place of a conventional chemical or mechanical polishing method, or by using this method together with the conventional method.
SOLUTION: A nozzle device which is arranged opposite to a surface to be polished of a substrate W and where the corrosive gas is blown from nozzles 50 against the surface to be polished to achieve the gas polish, is provided with a nozzle assembly 38 in which a plurality of nozzles 50 are decentralized at the prescribed intervals, and control mechanisms 24, 64, 66 to individually control the gas flow from each nozzle.
Inventors:
Shuhei Shinozuka
Kaori Miyoshi
Akira Fukunaga
Yoichi Kobayashi
Kaori Miyoshi
Akira Fukunaga
Yoichi Kobayashi
Application Number:
JP8951898A
Publication Date:
June 28, 2006
Filing Date:
March 18, 1998
Export Citation:
Assignee:
Ebara Corporation
International Classes:
C23F4/00; H01L21/302; C23F1/08; C23F1/12; H01L21/304; H01L21/3065; (IPC1-7): C23F1/08; C23F1/12; H01L21/3065; H01L21/304
Domestic Patent References:
| JP8157296A | ||||
| JP4246184A | ||||
| JP10018058A | ||||
| JP2069930A | ||||
| JP9115887A | ||||
| JP7231155A | ||||
| JP64064323A | ||||
| JP62162324A | ||||
| JP5933831A |
Attorney, Agent or Firm:
Isamu Watanabe
Shintaro Hotta
Susumu Ohata
Shintaro Hotta
Susumu Ohata