Title:
ノズル基板、インクジェットプリントヘッドおよびノズル基板の製造方法
Document Type and Number:
Japanese Patent JP7384561
Kind Code:
B2
Abstract:
To provide a nozzle substrate having a novel structure.SOLUTION: A nozzle substrate 3 comprises: a semiconductor substrate 30 having a first surface and a second surface; an oxide film 31 formed on the second surface of the semiconductor substrate; and a semiconductor film 32 formed on a surface on the opposite side of the semiconductor substrate in the oxide film. A nozzle hole 20 is formed on the first surface of the semiconductor substrate, and consists of: a recess 20a penetrating the semiconductor substrate and the oxide film in a thickness direction; and an ink ejection passage 20b which is formed on a bottom surface of the recess and has a circular cross section penetrating the semiconductor film in the thickness direction. The ink ejection passage includes: a taper part 20b1 in which the size of a cross section gradually decreases toward a surface on the opposite side of the oxide film in the semiconductor film; and an ink ejection straight part 20b2 in which one end communicates with a small diameter end of the taper part and the other end opens to a surface of the semiconductor film, and the size of the cross section is fixed.SELECTED DRAWING: Figure 4
Inventors:
Kensuke Hiraoka
Chihayato Yamamoto
Chihayato Yamamoto
Application Number:
JP2019026809A
Publication Date:
November 21, 2023
Filing Date:
February 18, 2019
Export Citation:
Assignee:
ROHM Co., Ltd.
International Classes:
B41J2/14; B41J2/16
Domestic Patent References:
| JP2009012328A | ||||
| JP2010131909A | ||||
| JP8506540A | ||||
| JP2019014229A | ||||
| JP2008155591A | ||||
| JP2018069685A | ||||
| JP2012084871A | ||||
| JP2014103210A |
Foreign References:
| WO2019012829A1 | ||||
| CN101284447A | ||||
| US20180117910 | ||||
| EP2147791A1 |
Attorney, Agent or Firm:
Patent Attorney Corporation Ai Patent Office