Title:
オルガノシロキサン
Document Type and Number:
Japanese Patent JP2006503165
Kind Code:
A
Abstract:
The present invention provides an organosiloxane comprising at least 80 weight percent of Formula I: [Y0.01-1.0SiO1.5-2]a[Z 0.01-1.0SiO1.5-2 ]b[H0.01-1.0SiO1.5-2]c where Y is aryl; Z is alkenyl; a is from 15 percent to 70 percent of Formula (I); b is from 2 percent to 50 percent of Formula (I); and c is from 20 percent to 80 percent of Formula (I).The present organosiloxane may be used as ceramic binder, high temperature encapsulant, and fiber matrix binder. The present composition is also useful as an adhesion promoter in that it exhibits good adhesive properties when coupled with other materials in non-microelectronic or microelectronic applications. Preferably, the present compositions are used in microelectronic applications as etch stops, hardmasks, and dielectrics.
Inventors:
Bet dowell, william
Husker, niger
Lyon, Roger
Iwamoto, Nancy
Nedvar, Jiyang
Xie, Song Yuan
Moro, Lorento
McHursey, Shyama
Husker, niger
Lyon, Roger
Iwamoto, Nancy
Nedvar, Jiyang
Xie, Song Yuan
Moro, Lorento
McHursey, Shyama
Application Number:
JP2004546678A
Publication Date:
January 26, 2006
Filing Date:
June 03, 2003
Export Citation:
Assignee:
Honeywell International Inc.
International Classes:
C08G77/20; C08G77/12; C09D183/04; C09J7/00; C09J183/05; C09J183/07; G03F7/075; H01L21/312; H01L21/768; H01L23/522
Attorney, Agent or Firm:
Yoshio Kawaguchi
Makoto Ono
Katsuma Osaki
Mitsuaki Tsubokura
Makoto Ono
Katsuma Osaki
Mitsuaki Tsubokura