Title:
ELECTRONIC COMPONENT MOUNTING APPARATUS
Document Type and Number:
Japanese Patent JP3196680
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To provide a electronic component mounting apparatus which vacuum- holds electronic components at the lower face of a nozzle and tests if the components exist during carrying of them of a substrate, etc., using an optical unit, without peeling down a dark color film formed on the lower face of the nozzle, for absorbing a light emitted from the optical unit as the edges of the component rub the film.
SOLUTION: A dark color film 23 is formed by the black Cr plating on the lower face of a nozzle 19 with ribs formed thereon, each having mountain- like tapers. The nozzle 19 vacuum holds an electronic component 20 with its edges butted to the ribs 25 and hence the edges of the component 20 never contact the film 23 and the film 23 never peels down. An optical unit 16 irradiates the lower face of the nozzle 19 with light to reliably judge the existence of the component 20 from the existence of its reflected light, without misjudgment.
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Inventors:
Tomoaki Nakanishi
Application Number:
JP4751597A
Publication Date:
August 06, 2001
Filing Date:
March 03, 1997
Export Citation:
Assignee:
Matsushita Electric Industrial Co., Ltd
International Classes:
H05K13/04; H01L21/52; (IPC1-7): H01L21/52; H05K13/04
Domestic Patent References:
| JP6325934A | ||||
| JP6244592A | ||||
| JP437096A | ||||
| JP290700A |
Attorney, Agent or Firm:
Fumio Iwahashi (2 others)