Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
OLEFIN POLYMER COMPOSITION
Document Type and Number:
Japanese Patent JPS6058410
Kind Code:
A
Abstract:

PURPOSE: To provide the titled composition having excellent adhesivity and rigidity, and useful as automobile parts, etc., by compounding an olefin polymer with an organic compound containing unsaturated bond and a hydroxyl group, an organic peroxide and an organic filler, and heating the mixture at a specific temperature to effect the decomposition of the peroxide.

CONSTITUTION: A mixture of (A) an olefin polymer (e.g. polypropylene), (B) an organic compound having at least one unsaturated bond and a hydroxyl group in the molecule (e.g. 3-hydroxy-1-propene), (C) an organic peroxide (e.g. dicumyl peroxide) and (D) an organic filler (e.g. epoxy resin), is heated at a temperature above the decomposition temperature of the component C and ≤250°C to obtain the objective composition wherein the ratio of the component D in the composition is 10W90wt%, and the amounts of the component B and the component C are 0.1W50pts.wt. and 0.01W20.0pts.wt. per 100pts.wt. of the component A, respectively.


Inventors:
TAKAISHI MINORU
NAGAI YOUZOU
TAKEMURA KENZOU
Application Number:
JP16413683A
Publication Date:
April 04, 1985
Filing Date:
September 08, 1983
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
SHOWA DENKO KK
International Classes:
C08K5/05; C08F2/44; C08F255/00; C08F255/02; C08F281/00; C08F289/00; C08F291/00; C08K5/14; C08L7/00; C08L21/00; C08L23/00; C08L23/02; C08L51/00; C08L51/02; C08L67/00; C08L77/00; C08L89/00; C08L101/00; (IPC1-7): C08F2/44; C08F255/02; C08F291/00; C08K5/05; C08K5/14; C08L23/02; C08L101/00
Domestic Patent References:
JPS5398351A1978-08-28
JPS4974230A1974-07-17
Attorney, Agent or Firm:
Minoru Terada



 
Previous Patent: An X-ray CT scanner and its program

Next Patent: JPS6058411