Title:
OLIGOMERIC HALOGENATED CHAIN EXTENDER FOR PREPARING EPOXY RESIN
Document Type and Number:
Japanese Patent JP2013136762
Kind Code:
A
Abstract:
To provide a resin that enables a laminate to exhibit needed thermal properties since the use of lead-free solder which melts at a high temperature further requires the thermal stability of the resin phase of the laminate.
An oligomeric halogenated chain extender composition comprises a reaction product of an excess amount of a halogenated phenolic compound (a) with a halogenated epoxy resin (b) in the presence of a solvent (c). A halogenated epoxide resin composition comprises a reaction product of the oligomeric halogenated chain extender composition with an epoxy resin. The halogen atom is preferably chlorine and/or bromine, and most preferably bromine.
Inventors:
GAN JOSEPH
HOEVEL BERND
HOEVEL BERND
Application Number:
JP2013022088A
Publication Date:
July 11, 2013
Filing Date:
February 07, 2013
Export Citation:
Assignee:
DOW GLOBAL TECHNOLOGIES LLC
International Classes:
C08G59/14
Domestic Patent References:
| JPS5996178A | 1984-06-02 | |||
| JPS5819322A | 1983-02-04 | |||
| JPH05230186A | 1993-09-07 | |||
| JPH059269A | 1993-01-19 | |||
| JPH10507481A | 1998-07-21 | |||
| JPS6456722A | 1989-03-03 |
Attorney, Agent or Firm:
Hiroshi Kobayashi
Norio Omori
Yasuhito Suzuki
Norio Omori
Yasuhito Suzuki