Title:
ONE-COMPONENT THERMOSETTING EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JPH05178964
Kind Code:
A
Abstract:
PURPOSE:To provide the title compsn. which cures rapidly at a low temp., is easily handled and excellent in storage stability, and exhibits a remarkably improved workability in sealing electronic and electric apparatuses. CONSTITUTION:The title compsn. is prepd. by compounding 100 pts.wt. diepoxy resin having an epoxy equivalent of 125-250, pref. 166-194, with 2-35 pts.wt., pref. 5-25 pts.wt., latent curative, 30-115 pts.wt., pref. 50-90 pts.wt., acid anhydride curative, and required amts. of a dioctylphosphoric ester or poyester platicizer and mercaptobenzothiazole or its deriv. or a mixture of these.
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Inventors:
SHIMAZAKI HIROMITSU
NAKAYAMA FUMIO
NAKAYAMA FUMIO
Application Number:
JP34510691A
Publication Date:
July 20, 1993
Filing Date:
December 26, 1991
Export Citation:
Assignee:
MATSUSHITA ELECTRIC IND CO LTD
International Classes:
C08G59/18; C08G59/00; C08G59/42; C08K5/47; C08K5/521; C08L63/00; (IPC1-7): C08G59/18; C08G59/42; C08K5/47; C08K5/521; C08L63/00
Attorney, Agent or Firm:
Taketoshi Mototoshi