Title:
ONE FACE ELECTROPLATING METHOD
Document Type and Number:
Japanese Patent JPS5573891
Kind Code:
A
Abstract:
PURPOSE:To remove generated foam at jetting time and to improve plating adhesion on the thick plate, by striking nozzle jetting flow against baffle plate provided facing to jetting nozzle of plating liquid vertically, at the time of keeping bath face constant overflowing and circulating plating liquid and plating the lower face of original plate. CONSTITUTION:The plating liquid 4 jetted from the jetting nozzle 2, is struck on the baffle plate 9 provided facing to the nozzle in front of the nozzle 2 vertically and is introduced to the bottom of the plating bath 1 along the plate 9 changing the course here and also foams are removed on the way. Next, the liquid 4 is flowed in laminar flow from the gap of the lower electrode head 6 between the plating original plate 3 and the lower electrode 5. On the other hand, generated H2 gas etc. by cathode reaction is removed by the above laminar flow favorably. The overflow opening 7 is provided on the side face of the bath 1 opposite to the side face provided the nozzle 2 at the same level to pass line of the plate 3 and plating bath face is maintained at a constant level always.
Inventors:
OGAWA TATSUYA
NAKAMURA TOKU
YAMATO KOUJI
IOZUMI HIROYUKI
NAKAMURA TOKU
YAMATO KOUJI
IOZUMI HIROYUKI
Application Number:
JP14477678A
Publication Date:
June 03, 1980
Filing Date:
November 22, 1978
Export Citation:
Assignee:
KAWASAKI STEEL CO
International Classes:
C25D7/06; C25D5/02; C25D5/08; (IPC1-7): C25D5/02; C25D5/08