Title:
一液常温湿気硬化型シーリング材組成物
Document Type and Number:
Japanese Patent JP7129176
Kind Code:
B2
Abstract:
To provide a one-pack ordinary temperature moisture curable sealant composition forming an appearance with integrated feeling with a wall material having a surface texture with a relatively clear unevenness of natural stone-like, or a joint structure of a wall material having the surface texture with the relatively clear unevenness of natural stone-like, and a joint structure with a joint groove formed on a surface without deteriorating basic performance such as elongation at maximum load or dirt prevention.SOLUTION: A one-pack ordinary temperature moisture curable sealant composition contains (A) a crosslinkable silicon group-containing organic polymer, (B) an inorganic porous expansion body having average particle size of 0.3 mm to 1.2 mm, and (D) an aliphatic amine compound having the melting point of 30°C or higher, contains (B) the inorganic porous expansion body in a range of 1.2 vol.% to 4.5 vol.% by volume concentration based on the one-pack ordinary temperature moisture curable sealant composition, and harmonize to a wall material with a natural stone-like surface texture.SELECTED DRAWING: Figure 3
Inventors:
Kengo Ishimaru
Hirohito Mizuno
Tomonori Saito
Naomi Okamura
Hirohito Mizuno
Tomonori Saito
Naomi Okamura
Application Number:
JP2018034148A
Publication Date:
September 01, 2022
Filing Date:
February 28, 2018
Export Citation:
Assignee:
DAIWA HOUSE INDUSTRY CO.,LTD.
Cemedine Co., Ltd.
Cemedine Co., Ltd.
International Classes:
C09K3/10; C08K5/17; C08K7/00; C08K7/24; C08L101/10; E04F13/02
Domestic Patent References:
| JP2007016129A | ||||
| JP9053063A | ||||
| JP2001059083A | ||||
| JP200139755A | ||||
| JP2001115142A | ||||
| JP200159083A | ||||
| JP200716248A | ||||
| JP2004307556A | ||||
| JP2009179776A | ||||
| JP2004107607A | ||||
| JP2014227427A |
Foreign References:
| WO2015098998A1 |
Attorney, Agent or Firm:
Satoshi now