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Patent Searching and Data


Title:
ONE PACK CURING TYPE RESIN EMULSION COMPOSITION
Document Type and Number:
Japanese Patent JP2000159968
Kind Code:
A
Abstract:

To provide a one pack curing type resin emulsion composition having excellent polymerization stability and excellent film formability and capable of forming films excellent in water (whitening), solvent and corrosion resistances.

This one pack curing type resin emulsion composition is prepared by dispersing a copolymer comprising structural units derived from the following component A, structural units derived from the following component B, and structural units derived from the following component C in an aqueous medium containing an emulsifier comprising at least one of a reactive surfactant and a water-soluble polymer. (A) A dicyclopentadiene derivative. (B) An alkoxysilyl group-containing monomer. (C) A polymerizable monomer capable of being copolymerized with the components A and B. The structural units derived from the component A, the structural units derived from the component B, and the structural units derived from the component C are preferably set to 0.5-40 wt.%, 0.01-5 wt.% and 55-99.49 wt.%, respectively, in the copolymer.


Inventors:
TOKIMORI YASUO
Application Number:
JP34220298A
Publication Date:
June 13, 2000
Filing Date:
December 01, 1998
Export Citation:
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Assignee:
NIPPON NSC LTD
International Classes:
C08L33/14; C08F2/24; C08L33/06; C08L43/04; C08L71/02; C08L83/10; (IPC1-7): C08L33/14; C08F2/24; C08L43/04; C08L71/02
Attorney, Agent or Firm:
Nishihiko Yasuhiko