Title:
ONE-PACK TYPE EPOXY RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2007254543
Kind Code:
A
Abstract:
To provide a one-pack type epoxy resin composition which improves the pot life while maintaining good permeability and connection reliability on heat cycle treatment when used as an under-filling material for sealing a gap between a semiconductor device and a substrate.
The one-pack type epoxy resin composition comprises a bisphenol type epoxy resin having a molecular weight of 400 or more, an inorganic filler, and a silane coupling agent having a nucleophilic functional group as essential components, and the above silane coupling agent preferably contains an aminosilanes.
COPYRIGHT: (C)2008,JPO&INPIT
Inventors:
NISHIDA MOTOYA
Application Number:
JP2006079095A
Publication Date:
October 04, 2007
Filing Date:
March 22, 2006
Export Citation:
Assignee:
SUMITOMO BAKELITE CO
International Classes:
C08L63/00; C08G59/06; C08K3/00