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Title:
ONE-PACKAGE COMPOSITE CURABLE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP3871046
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide a one-package composite curable composition having excellent preservability, a slight change in viscosity and excellent operating efficiency, readily solidifiable and fixing an adherend by irradiation of light such as ultraviolet rays or visible rays and having sufficient adhesive strength by subsequent hot curing.
SOLUTION: The one-package composition comprises (a) a compound having one or more epoxy groups in one molecule, (b) a 2,4-diamino-6-(2')-methylimidazole-(1')-ethyl-s-triazine isocyanuric acid adduct, (c) a compound having an unsaturated double bond in one molecule and (d) a compound generating a radical by light irradiation.


Inventors:
Yoshihide Arai
Manabu Inoue
Application Number:
JP2002295185A
Publication Date:
January 24, 2007
Filing Date:
October 08, 2002
Export Citation:
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Assignee:
ThreeBond Co., Ltd.
International Classes:
C08F2/44; C08G59/40; C08F283/10; C09J4/00; C09J163/00; (IPC1-7): C08G59/40; C08F2/44; C08F283/10; //C09J4/00; C09J163/00
Domestic Patent References:
JP4195051A
JP8165459A
JP60049024A
JP2000239639A