Title:
ONE-RACK PLATING METHOD FOR RESIN
Document Type and Number:
Japanese Patent JP3822193
Kind Code:
B2
Abstract:
PROBLEM TO BE SOLVED: To easily and quickly plate even a resin-molded article made of a resin material, which is difficult to be plated, by dispensing with changing a holder for plating among the steps of conducting treatment, chemical plating treatment and electroplating treatment.
SOLUTION: This plating method comprises previously coating a removable paint on the holder for plating, which hangs the resin-molded article (Sa1); bonding a catalyst to the resin-molded article and the holder for plating (Sa6); and dissolving the paint coated on the holder for plating to remove the catalyst absorbed in the holder for plating (Sa8) and to prevent the deposition of a plating metal. Thereby, the changing the holder for plating is dispensed with.
Inventors:
Kunihiro Kakihara
Yoshinori Noda
Yoshinori Noda
Application Number:
JP2003199517A
Publication Date:
September 13, 2006
Filing Date:
July 18, 2003
Export Citation:
Assignee:
Kakihara Industry Co., Ltd.
International Classes:
C25D17/08; (IPC1-7): C25D17/08
Domestic Patent References:
| JP2000204480A | ||||
| JP2001313514A | ||||
| JP60077994A |
Attorney, Agent or Firm:
Yoshiaki Takemasa
Field saki Akira
Field saki Akira
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