Title:
OPERATION ASSISTING DEVICE, OPERATION ASSISTING PROGRAM, OPERATION ASSISTING METHOD AND POLISHING DEVICE
Document Type and Number:
Japanese Patent JP2021157693
Kind Code:
A
Abstract:
To further surely detect an abnormality occurring on a semiconductor manufacturing device.SOLUTION: An operation assisting device 6 includes: a determination object data obtaining unit 61 that obtains determination object data which are data on a semiconductor manufacturing device and which are subjected to a determination on whether or not a predetermined standard is satisfied; a data determining unit 62 that determines whether or not the determination object data satisfy the predetermined standard using an already-learnt model created by inputting, into a machine learning device, learning data that contain first data which are data on the semiconductor manufacturing device and which satisfy the predetermined standard, and second data which are on the semiconductor manufacturing device and which do not satisfy the predetermined standard; and a determination result data output unit 63 that outputs determination result data representing a result determined by the data determining unit 62.SELECTED DRAWING: Figure 1
Inventors:
KUROKI YUSUKE
IMAMURA HAYAO
YAMAZAKI TAKASHI
UOZUMI SHUJI
SHINKAI TAKESHI
IMAMURA HAYAO
YAMAZAKI TAKASHI
UOZUMI SHUJI
SHINKAI TAKESHI
Application Number:
JP2020059667A
Publication Date:
October 07, 2021
Filing Date:
March 30, 2020
Export Citation:
Assignee:
EBARA CORP
International Classes:
G05B23/02; B24B37/005; B24B53/00; G06N20/00
Attorney, Agent or Firm:
Sumio Tanai
Yasushi Matsunuma
Yuichiro Shimizu
Hisanori Takahashi
Yasushi Matsunuma
Yuichiro Shimizu
Hisanori Takahashi