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Title:
OPTICAL ASSEMBLY
Document Type and Number:
Japanese Patent JP3147141
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide an optical assembly structure constituted by mounting a semiconductor element which generates large heat and an optical element which has high impedance on the same optical waveguide substrate.
SOLUTION: The element 2 which generates large heat is adhered onto a projection part 11 of the semiconductor substrate 10 directly or across an insulator layer of thickness of about submicrons. The optical element 3 with high impedance, on the other hand, is put in a groove formed in a recessed part of the semiconductor substrate 10 so that its optical axis is aligned with an optical waveguide layer coupled with the element. Or the potential of the semiconductor substrate 10 is held as high as a source voltage or ground potential to invert the polarity of the substrate crystal of the heat generating element 2 which is biased forward and the reverse bias element 3 which has a problem of floating capacity. Consequently, the element 2 which generates large heat and the high-impedance optical element 3 can be mounted on the same optical waveguide substrate while aligned with the optical axis of the optical waveguide 1. Consequently, a hybrid circuit having various optical elements and electronic elements built in on an optical waveguide can be mounted at low cost.


Inventors:
Shinji Tsuji
Ryuta Takahashi
Masato Shishikura
Satoru Kikuchi
Satoshi Aoki
Application Number:
JP22143395A
Publication Date:
March 19, 2001
Filing Date:
August 30, 1995
Export Citation:
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Assignee:
株式会社日立製作所
日立電線株式会社
日立東部セミコンダクタ株式会社
日本電信電話株式会社
International Classes:
G02B6/122; G02B6/42; H01L27/15; H01L31/0232; H01S5/00; H01S5/022; H04B10/40; H04B10/50; H04B10/60; H04B10/67; (IPC1-7): H01S5/022; G02B6/122; H01L27/15; H01L31/0232; H04B10/04
Domestic Patent References:
JP878657A
JP373583A
JP8334657A
JP7318765A
Attorney, Agent or Firm:
Yasuo Sakuta