PURPOSE: To provide an optical circuit with thin thickness at low costs by providing a slit whose width is substantially equal to the size of an optical element at the specific place of a non-rigid insulated supporting body, inserting the optical element so as to be brought into contact with the part of a solder member, and heating the solder member so as to be melted.
CONSTITUTION: A ribbon 20 has a copper conductive band 22 covered with a solder layer 30 on the upper face. Then, a slit 24 is cut at a constant place. An element 25 is inserted in the slit 24, electrodes 25' and 25" of the element are brought into contact with the solder layer 30, and the element 25 remains by spring generated at an edge due to the partial push-back of the ribbon 20. After the solder layer 30 is melted, the electrodes 25' and 25" are soldered to the band 22 in a groove 31. Thus, an optical circuit with thin thickness is obtained, and the problem of the cost is solved.
MISHIERU BURONDE
RIONERU GIRUMAN
