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Patent Searching and Data


Title:
OPTICAL COMMUNICATION MODULE, OPTICAL COMMUNICATION SYSTEM AND ITS MANUFACTURE METHOD
Document Type and Number:
Japanese Patent JP3960257
Kind Code:
B2
Abstract:

PROBLEM TO BE SOLVED: To provide an optical communication module which is simply connectable to an external circuit, has high product reliability and is small-sized and inexpensive.
SOLUTION: The optical communication module includes a substrate 1 having a through-hole 2 through which an optical fiber can be inserted and removed, a light transmitting resin film 6 which is disposed on a half surface of the substrate 1 so as to cover the whole through-hole 2 therewith and has an overhang part 9 extended outward from the substrate 1, a wiring film 7 which is arranged on the through-hole 2 or on the part reaching from a position near the through-hole 2 to the overhang part 9 on at least the half surface of the light transmitting resin film 6 and an optical element 3 which is connected to the wiring film 7 and is disposed on the through-hole 2 via the light transmitting resin film 6, and a connection part with the external circuit is formed on the overhang part 9 of the light transmitting resin film 6 to solve the problem.


Inventors:
Akira Miyamae
Application Number:
JP2003122381A
Publication Date:
August 15, 2007
Filing Date:
April 25, 2003
Export Citation:
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Assignee:
Seiko Epson Corporation
International Classes:
G02B6/42; (IPC1-7): G02B6/42
Domestic Patent References:
JP6310759A
JP59111123A
JP9090175A
JP49065790A
JP2002100785A
JP2002072021A
JP2002182077A
Attorney, Agent or Firm:
Yoshiyuki Inaba
Katsuro Tanaka
Shinji Oga