Title:
光コネクタ研磨用パッド
Document Type and Number:
Japanese Patent JP7264775
Kind Code:
B2
Abstract:
An embodiment of the invention of this application provides a polishing pad that eliminates a gap between an optical connector and a polishing film during polishing. A polishing pad of the embodiment is used by being placed between a polishing platen and a polishing sheet in a case of performing spherical polishing of an end surface of an optical connector including an optical fiber and a ferrule. The optical connector polishing pad of the embodiment has rebound resilience higher than 20%. The optical connector polishing pad of the embodiment can be formed from a urethane-based material.
Inventors:
Kenji Aoki
Konishi Masaaki
Naoki Sugita
Konishi Masaaki
Naoki Sugita
Application Number:
JP2019160275A
Publication Date:
April 25, 2023
Filing Date:
September 03, 2019
Export Citation:
Assignee:
NTT Advanced Technology Corporation
International Classes:
B24B19/00; G02B6/36
Domestic Patent References:
| JP2011110657A | ||||
| JP2012061572A | ||||
| JP2006341473A | ||||
| JP2018040916A | ||||
| JP2003205447A | ||||
| JP2015519209A | ||||
| JP63185558A |
Foreign References:
| US20050282470 | ||||
| WO2016027671A1 | ||||
| US5184433 |
Attorney, Agent or Firm:
Patent Attorney Tani / Abe Patent Office
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