To make it possible to simultaneously connect an optical fiber and an optical control element on the same substrate by irradiating a UV curing resin applied on the optical fiber on an Si substrate to cover the optical fiber with UV rays and pressing the optical fiber.
A cap part 14 in the upper part of a device body is closed and the optical fiber 10 is pressurized from above by a compressing jig 12 via a metallic plate 23 and a Teflon (R) plate 22. Simultaneously, the device body is irradiated with the UV rays from oblique above to cure the UV curing resin, by which the optical fiber 20 is adhered and fixed to a V-groove. At this time, the optical control element mounted onto the Si substrate 19 is simultaneously adhered and fixed to the Si substrate 19 as well. In such a case, the Teflon (R) plate 22 has a size to cover the entire part of the Si substrate 19 and is pressed via the metallic plate 23 larger than the Teflon (R) plate 22. When the UV curing resin cures, a compressing jig 12 is moved upward by operating a valve 26 and is parted from the Si substrate 19. Further, the cap part 14 is opened and the Si substrate 19 and the optical fiber 20 are respectively removed from a table 15 and a fine adjustment table 16.
SASAKI JUNICHI
HONMO HIROSHI
ITO MASATAKA
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