Title:
高周波信号伝送用光モジュール及びその製造方法
Document Type and Number:
Japanese Patent JP4002231
Kind Code:
B2
Abstract:
The present invention relates to a high-frequency signal transmitting optical module which can easily realize a high-frequency signal transmission by use of a semiconductor optical device to which a highly versatile metal can package has been applied. In the high-frequency signal transmitting optical module, after fixing to a rear surface of a stem of the metal can package, fixing portions of the linear outer leads by laser welding, the end portions of the outer leads are bent. By this, the outer leads can be easily attached to the semiconductor optical device. Since the outer leads are attached to the rear surface of the stem on both sides of the signal lead pins, ground regions are continuously provided on both sides of the respective lead pins, whereby TEM wave transmission lines are formed. Accordingly, high-frequency signals can be transmitted to the semiconductor optical device.
Inventors:
Sadahisa Warashina
Hoshino Yasushi
Katsura Tabata
Shogo Iyama
Hoshino Yasushi
Katsura Tabata
Shogo Iyama
Application Number:
JP2003382540A
Publication Date:
October 31, 2007
Filing Date:
November 12, 2003
Export Citation:
Assignee:
Hamamatsu Photonics Co., Ltd.
International Classes:
H01L23/04; H01L31/02; H01L21/48; H01L23/049; H01L23/495; H01L31/0203; H01S5/022; H01S5/02
Domestic Patent References:
| JP59101882A | ||||
| JP2003229629A | ||||
| JP8114728A | ||||
| JP2004235571A |
Foreign References:
| US4309717 | ||||
| US4831723 |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Shiro Terasaki
Satoru Ishida
Shiro Terasaki
Satoru Ishida