Title:
光モジュール及びその製造方法
Document Type and Number:
Japanese Patent JP7200670
Kind Code:
B2
Abstract:
An optical module includes an optical semiconductor chip having a first surface that includes a laser beam irradiation region and a cleavage region, an optical fiber optically coupled to the first surface, and a support member having a second surface bonded to the first surface, and configured to support the optical fiber. The optical semiconductor chip has an optical signal input and output part located in the cleavage region, and the second surface is bonded to the first surface within the cleavage region.
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Inventors:
Kohei Shibata
Tatsuya Ito
Tatsuya Ito
Application Number:
JP2018245536A
Publication Date:
January 10, 2023
Filing Date:
December 27, 2018
Export Citation:
Assignee:
Fujitsu Optical Components Limited
International Classes:
G02B6/30; G02B6/42
Domestic Patent References:
| JP5249349A | ||||
| JP2006068816A |
Foreign References:
| CN103487902A |
Attorney, Agent or Firm:
Tadashige Ito
Tadahiko Ito
Tadahiko Ito
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