To make it possible to maintain a waveguide chip at prescribed temperature without increasing electric power consumption even if outdoor temperature rises high by covering the endothermic side periphery of at least a temperature compensating means in a package with thermally insulating material.
This optical module is constituted by providing the waveguide chip 7 with the temperature compensating means 8, such as a Peltier element, via a soaking plate 9, housing this chip a package 11 and leading the optical fiber 10 connected to the waveguide chip 7 to the outside of the package 11. In such a case, the thermally insulating material 12 is packed into the package 11. Foamable silicone or foamed polyurethane is usable as the thermally insulating material 12. The heat flowing into the package 11 may be prevented from arriving at the temperature compensating means 8 by packing the thermally insulating material 12 into the package 11 in the manner described above. The waveguide chip 7 may thus be maintained at the prescribed temperature without increasing the electric power consumption of the temperature compensating means 8. The occurrence of dew condensation on the endothermic side 8a of the temperature compensating means 8 is prevented.
OTA TOSHIHIKO
TORATANI TOMOAKI
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