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Title:
OPTICAL MODULE
Document Type and Number:
Japanese Patent JP2008197500
Kind Code:
A
Abstract:

To highly accurately control an optical wavelength, by reducing as much as possible a thermal contraction stress and a residual contraction stress to a substrate 1 caused by a difference between the linear expansion coefficients of the substrate 1 and a carrier 6, in an optical module obtained by bonding the substrate 1 comprising PLC and the carrier 6 holding it.

For the purpose of equalizing the linear expansion coefficients of the substrate 1 and the carrier 6, the carrier 6 is made of a material having the same property as that of the substrate 1, to mount the substrate 1 soldered onto the carrier 6.


Inventors:
TOMITA ISAO
NIDOU MASAAKI
KANEKO TARO
Application Number:
JP2007034160A
Publication Date:
August 28, 2008
Filing Date:
February 14, 2007
Export Citation:
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Assignee:
NEC CORP
International Classes:
G02B6/42; H01S5/022; H01S5/14
Domestic Patent References:
JPH1146034A1999-02-16
JPH1152190A1999-02-26
JPH10133069A1998-05-22
JP2003270467A2003-09-25
JP2004341147A2004-12-02
JP2006276519A2006-10-12
JP2006278770A2006-10-12
JPH10290052A1998-10-27
JPH0862441A1996-03-08
JPS643624A1989-01-09
JP2004104076A2004-04-02
JP2001051139A2001-02-23
Attorney, Agent or Firm:
Isamu Takahashi