To stabilize the characteristics of an optical module formed by housing a surface light emitting (light receiving) type optical element, optical fiber, etc., in one package and to reduce its cost.

That surface light emitting element (for example, LED) 16 is once packaged via bumps 18 on a sub-substrate 10. Next, this subsubstrate 10 is packaged on a packaging substrate 11 via the bumps 18. The LED 16 is inspectable in the stage where the LED is packaged on the sub-substrate 10 and, therefore, defective articles are expelled. Since both of the LED 16 and the sub-substrate 10 are flip-chip packaged, the exact positioning of the LED 16 to the optical fiber 13 is possible as well.