Title:
光受信モジュール
Document Type and Number:
Japanese Patent JP4178995
Kind Code:
B2
Abstract:
The present invention provides a light-receiving module that realized a reliable wire bonding from a light-receiving device to a die-capacitor on which the light-receiving device is mounted with adhesive. The light-receiving module of the present invention includes a stem and a die-capacitor disposed on the set. The upper electrode of the die-capacitor has a mounting area where the light-receiving device is mounted, a bonding area to which the bonding-wire is to be bonded, and a structure for interrupting the adhesive from spreading from the mounting area to the bonding area. Since the adhesive for die-bonding the light-receiving device in the mounting area does not spread to the bonding area, the wire-bonding to the bonding area can be reliably performed.
Inventors:
Makoto Ito
Application Number:
JP2003049994A
Publication Date:
November 12, 2008
Filing Date:
February 26, 2003
Export Citation:
Assignee:
Sumitomo Electric Industries, Ltd.
International Classes:
H01L31/02; H01J40/14; H01L29/74; H01L31/111
Domestic Patent References:
| JP2001296457A | ||||
| JP9167848A |
Attorney, Agent or Firm:
Yoshiki Hasegawa
Tatsuya Shioda
Shiro Terasaki
Masatoshi Shibata
Tatsuya Shioda
Shiro Terasaki
Masatoshi Shibata