Title:
光受信サブアセンブリ及び光モジュール
Document Type and Number:
Japanese Patent JP7141880
Kind Code:
B2
Abstract:
To efficiently arrange wiring.SOLUTION: An optical reception sub assembly includes an optical interface 30, a plurality of light receiving elements 44 arranged side by side in a first direction D1, an integrated circuit chip 52 that is adjacent to and electrically connected to the plurality of light receiving elements 44 in a second direction D2 crossing the first direction D1, an electrical interface 14 electrically connected to the integrated circuit chip 52, a wiring board 54 fixed to the inside of the upper surface with a size smaller than the upper surface of the integrated circuit chip 52, and a plurality of wires bonded to the wiring board 54. The plurality of wires include a plurality of first wires W1 bonded to the electrical interface 14, and a plurality of second wires W2 electrically connected to the integrated circuit chip 52.SELECTED DRAWING: Figure 4
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Inventors:
Masato Shishikura
Application Number:
JP2018140222A
Publication Date:
September 26, 2022
Filing Date:
July 26, 2018
Export Citation:
Assignee:
Lumentum Japan Co., Ltd.
International Classes:
H01L31/02; G02B6/42; H01L31/0232
Domestic Patent References:
| JP2013140292A | ||||
| JP2016092260A | ||||
| JP2017098616A |
Foreign References:
| US20160336368 |
Attorney, Agent or Firm:
Patent Attorney Corporation Haruka International Patent Office