Title:
OPTICAL SEMICONDUCTOR DEVICE, OPTICAL INTERCONNECTION SYSTEM, AND OPTICAL WIRING MODULE
Document Type and Number:
Japanese Patent JP2005250003
Kind Code:
A
Abstract:
To provide an optical semiconductor device capable of packaging a light emitting device or a light receiving device and a fiber (optical fiber) highly precisely in a short time.
On a surface emitting laser substrate (2) on which surface emitting laser diodes (1) of a light emitting device are formed, ring-shaped projections (3a) are provided in alignment as correctly as the surface emitting laser diodes are formed. Thus, an optical fiber (5) can be connected with sufficient positional accuracy by locating the ring-shaped projection (3a) around the surface emitting laser diode (1), and utilizing a self-alignment function of a fixing material (11).
Inventors:
HIROI MASAKI
Application Number:
JP2004058771A
Publication Date:
September 15, 2005
Filing Date:
March 03, 2004
Export Citation:
Assignee:
RICOH KK
International Classes:
G02B6/42; H01S5/022; H01S5/42; (IPC1-7): G02B6/42; H01S5/022; H01S5/42
Attorney, Agent or Firm:
Masaharu Uemoto