Title:
光半導体照明装置
Document Type and Number:
Japanese Patent JP5211257
Kind Code:
B2
Abstract:
Disclosed herein is an optical semiconductor lighting apparatus. The optical semiconductor lighting apparatus includes a heat sink including a heat dissipation base and a plurality of heat dissipation fins formed on a lower surface of the heat dissipation base; an optical semiconductor device placed on the heat dissipation base; and an optical cover coupled to an upper side of the heat sink to cover the optical semiconductor device. Here, the heat dissipation base is formed with an air flow hole through which upper ends of the heat dissipation fins are exposed. The optical semiconductor lighting apparatus provides convenience in overhaul and repair, permits easy assembly and disassembly, and has excellent waterproof performance and endurance. In addition, the optical semiconductor lighting apparatus may minimize optical loss or occurrence of dark areas and may provide broad and uniform illumination via an optical cover integrally formed with lenses. Further, the optical semiconductor lighting apparatus may minimize optical loss caused by absorption of light by a protrusion formed on the heat sink to absorb light emitted from an optical semiconductor device or an optical semiconductor chip. Further, the heat sink has an air flow passage defined from a lower side thereof to an upper side thereof to improve heat dissipation performance. Further, for a lighting apparatus including a plurality of light emitting modules, the present invention provides an easy and reliable connection structure for electrically connecting the light emitting modules to each other. Furthermore, the optical semiconductor lighting apparatus has a large heat dissipation area to improve heat dissipation efficiency while providing improved cooling efficiency via natural convection.
Inventors:
Lord Yun People
Gold People Tree
Sadakazu Kim
Kim Dong Shu
Gold and tin
Gold People Tree
Sadakazu Kim
Kim Dong Shu
Gold and tin
Application Number:
JP2012179586A
Publication Date:
June 12, 2013
Filing Date:
August 13, 2012
Export Citation:
Assignee:
POSCO ELEEDI Company Limited
International Classes:
H01L33/64; F21S2/00; H01L33/58; F21Y101/02
Domestic Patent References:
| JP3143732U | ||||
| JP2005108544A | ||||
| JP2003347601A | ||||
| JP2004128433A | ||||
| JP2004207367A | ||||
| JP2009245846A | ||||
| JP3110731U | ||||
| JP56851U | ||||
| JP8316385A | ||||
| JP533539U |
Foreign References:
| WO2007126074A1 | ||||
| WO2009110683A1 |
Attorney, Agent or Firm:
Takahashi Hayashi & Partners