To provide an optical sensor package structure which can be produced conveniently while enhancing a production yield.
The optical sensor package structure comprises a substrate having upper and lower surfaces where a plurality of signal input ends are provided on the upper surface and a plurality of signal output ends are provided on the lower surface, a protruding fringe layer having upper and lower end faces where the lower end face is placed on the upper surface of the substrate to form a containing chamber together with the substrate and a groove is provided in the upper end face, a photosensing chip having an upper surface provided with a plurality of bonding pads and being located in the containing chamber on the upper surface of the substrate, a plurality of lead wires for connecting the bonding pads of the photosensing chip electrically with the signal input ends of the substrate, an adhesive layer being applied to the upper surface of the protruding fringe layer and placed in the groove, and a translucent layer located on the upper surface of the protruding fringe layer and bonded to the protruding fringe layer through the adhesive layer.
GO SHISEI
CHEN BING-GUANG
CHEN RUNG-TING
Hideo Sugiyama
Koichi Yuda
Uozumi Takahiro
Naohiko Teshima
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