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Title:
ORGANIC ELECTRONIC PANEL AND METHOD FOR MANUFACTURING THE SAME
Document Type and Number:
Japanese Patent JP2015097208
Kind Code:
A
Abstract:
PROBLEM TO BE SOLVED: To provide a method for removing an electrode lead in a small space without deteriorating sealing performance while the conductivity and the adhesiveness thereof are sufficiently maintained, in an organic electronic panel using a flexible substrate.SOLUTION: In an organic electronic panel, an organic electronic element configured so that a pair of electrodes 2, 4 are provided on a supporting substrate 1, and an organic compound layer 3 containing a function layer comprising at least an organic compound is sandwiched by the pair of electrodes, is hermetically sealed by a sealing member 5 covering the organic electronic element, between the supporting substrate and the sealing member while the electrodes and the organic compound layer are held. A joint portion between a pulling portion 2a of each electrode and an electrode lead 7 connected to an outside drive circuit is disposed within an area covered and hermetically sealed by the sealing member, and the electrode lead is removed from the hermetically sealed area.

Inventors:
KOJIMA SHIGERU
MURAYAMA MASAAKI
GENDA KAZUO
NOJIMA TAKAHIKO
Application Number:
JP2014250697A
Publication Date:
May 21, 2015
Filing Date:
December 11, 2014
Export Citation:
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Assignee:
KONICA MINOLTA INC
International Classes:
H05B33/04; H01L51/44; H01L51/50; H05B33/02; H05B33/06; H05B33/10
Domestic Patent References:
JPH0883919A1996-03-26
JPH11307249A1999-11-05
JP2002175877A2002-06-21
JP2008010211A2008-01-17
JP2007258053A2007-10-04
JP2001176633A2001-06-29
JP2002373777A2002-12-26
Foreign References:
WO2008120513A12008-10-09
Attorney, Agent or Firm:
Shinto International Patent Office



 
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