Login| Sign Up| Help| Contact|

Patent Searching and Data


Title:
有機膜形成用組成物、半導体装置製造用基板、有機膜の形成方法、パターン形成方法、及び重合体
Document Type and Number:
Japanese Patent JP6940335
Kind Code:
B2
Abstract:
The invention provides a composition for forming an organic film, which generates no by-product even under such a film formation condition in an inert gas to prevent substrate corrosion, which is capable of forming an organic film not only excellent in properties of filling and planarizing a pattern formed on a substrate but also favorable for dry etching resistance during substrate processing, and further which causes no fluctuation in film thickness of the film due to thermal decomposition even when a CVD hard mask is formed on the organic film. The composition for forming an organic film includes (A) a polymer having a repeating unit shown by the following general formula (1) and (B) an organic solvent.

Inventors:
Daisuke Gun
Tsutomu Ogiwara
Takeshi Watanabe
Keisuke Niida
Satoshi Sawamura
Application Number:
JP2017166240A
Publication Date:
September 29, 2021
Filing Date:
August 30, 2017
Export Citation:
Click for automatic bibliography generation   Help
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C08L61/18; C08G10/00; C08L61/26; C09D161/00; G03F7/11; G03F7/26; H01L21/027
Domestic Patent References:
JP2017021329A
JP2012215842A
JP2017119671A
JP2017082205A
JP2016044272A
JP2016206676A
Foreign References:
WO2013047516A1
WO2016021594A1
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi