Title:
有機膜形成材料、有機膜の形成方法、パターン形成方法、および化合物
Document Type and Number:
Japanese Patent JP7145143
Kind Code:
B2
Abstract:
The present invention provides a material for forming an organic film, containing a compound shown by the following general formula (1), and an organic solvent, where X represents an organic group having a valency of n1 and 2 to 50 carbon atoms, n1 represents an integer of 1 to 10, and R1 represents at least one or more of the following general formulae (2) to (4). This aims to provide an organic film material for forming an organic film that has all of high filling property, high planarizing property, and excellent adhesive force to a substrate.
Inventors:
Daisuke Gun
Takayoshi Nakahara
Yusuke Miyajima
Takayoshi Nakahara
Yusuke Miyajima
Application Number:
JP2019224907A
Publication Date:
September 30, 2022
Filing Date:
December 12, 2019
Export Citation:
Assignee:
Shin-Etsu Chemical Co., Ltd.
International Classes:
C09D139/04; C07D209/48; C07D403/14; C07D487/04; C08F26/04; C08F238/00; C08G65/38; C09D7/20; C09D7/63; C09D149/00; G03F7/11; G03F7/20; G03F7/26
Domestic Patent References:
| JP2017119670A | ||||
| JP2004339373A |
Foreign References:
| WO2018212116A1 | ||||
| WO2019167359A1 |
Attorney, Agent or Firm:
Mikio Yoshimiya
Toshihiro Kobayashi
Toshihiro Kobayashi
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