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Title:
ORGANIC-INORGANIC COMPOSITE PARTICLE, METHOD FOR PRODUCING THE SAME, THERMALLY CONDUCTIVE RESIN COMPOSITION, AND METHOD FOR PRODUCING THE SAME
Document Type and Number:
Japanese Patent JP2011214000
Kind Code:
A
Abstract:

To provide an organic-inorganic composite particle which has sufficient thermal conductivity, hardly causes deterioration in thermal conductivity during use, and can be produced by a simple method; a method of producing the organic-inorganic composite particle; a thermally conductive resin composition containing the organic-inorganic composite particles and a matrix resin; and a method for producing the thermally conductive resin composition.

The organic-inorganic composite particle comprises a core consisting of a vinyl polymer, inorganic particles covering the core, polyalkoxy siloxane included between the core and the inorganic particles. The thermal conductivity of the inorganic particles is 10 W/(m*K) or higher. In the method for producing the organic-inorganic composite particle, a monomer mixture comprising 100 pts.wt. of a polymerizable vinyl monomer, a polymerization initiator, and a polyalkoxy siloxane oligomer which is inert to the polymerizable vinyl monomer is subjected to water-based suspension polymerization in the presence of 0.5 pts.wt. or more of the inorganic particles with the thermal conductivity of 10 W/(m*K) or higher.


Inventors:
YAMAGUCHI YOHEI
KUSAKA AKIYOSHI
Application Number:
JP2011055830A
Publication Date:
October 27, 2011
Filing Date:
March 14, 2011
Export Citation:
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Assignee:
SEKISUI PLASTICS
International Classes:
C08L101/02; C08F292/00; C08K3/00; C08K5/5415; C08L83/04
Domestic Patent References:
JP2007217645A2007-08-30
JP2009209355A2009-09-17
Attorney, Agent or Firm:
Patent Business Corporation Ark Patent Office