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Title:
ORGANIC-INORGANIC PHOTOSENSITIVE RESIN COMPOSITION
Document Type and Number:
Japanese Patent JP2008088195
Kind Code:
A
Abstract:

To obtain a photosensitive transparent resin composition that is useful for producing a solid imaging element and an integrated product of electronic component requiring a solder reflow process and has excellent properties of reflow heat resistance of 260C and UV yellowing resistance, and to provide a plastic micro-lens or an optical element for a liquid crystal polarizing plate, which uses the photosensitive transparent resin composition.

The photosensitive resin composition comprises a resin obtained by subjecting a specific organosilane-containing compound to condensation polymerization in the presence of a catalyst at 40C to 150C for 0.1-10 hours and an ultraviolet light absorber having an absorption region at 280-380 nm. The method for producing a plastic micro-lens or an optical element for a liquid crystal polarizing plate comprises using the photosensitive resin composition.


Inventors:
KOBAYASHI TAKAAKI
Application Number:
JP2006267034A
Publication Date:
April 17, 2008
Filing Date:
September 29, 2006
Export Citation:
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Assignee:
ASAHI KASEI DENSHI KK
International Classes:
C08F299/08; G02B3/00; G02F1/1335
Domestic Patent References:
JP2006244579A2006-09-14
JP2005298800A2005-10-27
JP2003105033A2003-04-09
JP2002156502A2002-05-31
JPH08286002A1996-11-01
JP2000266909A2000-09-29
JP2006508216A2006-03-09
Attorney, Agent or Firm:
Yoshio Narui
Takeshi Shimizu
Joi Ito
Hideo Takei